Dallas, Tex.— Texas Instruments Inc.'s PCI Express (PCIe) x1 physical layer (PHY) chip has hit the market in volume, providing a low-cost PCI Express endpoint device for a wide variety of sectors such ...
- High speed DDR-2 interface core and I/O provide customers a physical layer solution that is easily integrated into their ASIC - Cuts time, cost and complexity of OEM product development - Capability ...
PISCATAWAY, N.J.--(BUSINESS WIRE)--The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced that development ...
PISCATAWAY, N.J.--(BUSINESS WIRE)--The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced a major update ...
HSINCHU, Taiwan, July 22, 2025--(BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design and IP provider, today announced the availability of its DDR/LPDDR combo PHY, ...
September 23, 2014. Tektronix has announced a complete PHY layer and conformance test solution for JEDEC LPDDR4, the next generation of mobile memory technology. Slated for adoption starting in 2015, ...
The script for the M-PHY specification was written inside the MIPI (Mobile Industry Processor Interface) Alliance by a working group made up of member companies, and set up to expand the capabilities ...
The combined resources of Cadence Design Systems and Denali Software have resulted in an advanced double-data-rate (DDR) PHY methodology based on Cadence’s Encounter digital IC design platform. The ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results