Recently, we stumbled upon a video by [iBoff], adding an M.2 NVMe port to a 2011-2013 MacBook. Apple laptops never came with proper M.2 ports, especially the A1278 – so what’s up? The trick is – ...
Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...
Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will ...
LISLE, Ill. – January 29, 2009– Molex Incorporated (NASDAQ: MOLX AND MOLXA) and Neoconix have developed a flexible copper high-density and speed (HD&S) interposer in a tool-less, easy-to-use ...
The design and analysis of an SoC based on an interposer is not for the faint of heart today, but the industry is aware of the challenges and is attempting to solve them. Until that happens, however, ...
Abstract—The market for Semiconductor Intellectual Property is well served for standard process technologies but not all functions are offered in all processes. Mixing and matching high performance ...
Silicon interposer technology allows multiple die to be combined onto a single chip. This is different from stack or multi-die chips that use wires to connect to a substrate. Essentially, the ...
Psst! Hey kid! Want to reverse-engineer some iPhones? Well, did you know that modern iPhones use PCIe, and specifically, NVMe for their storage chips? And if so, have you ever wondered about sniffing ...
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