An addition to the 1455 series of extruded aluminum enclosures, the 1455NHD features six integral, heat-dissipating fins in the extrusion profile, to enhance cooling of enclosed electronics that ...

Thinner fins employed in ultra-high ratio extrusion heat sinks for power semiconductors provide more surface area per unit width, at lower cost than their predecessors. Also, they reduce air flow back ...

Ever-increasing levels of heat in today's power electronics necessitate constant efforts to increase heat sink efficiency by expanding the number of extended surfaces (fins) for cooling. Due to the ...

Aluminum is particularly well suited to the extrusion process due to its excellent plasticity at extrusion temperature. Only a minor degree of work-hardening takes place at this temperature and ...