Navitas Semiconductor has announced its 4.5-kW AI data center power supply reference design, with GaNSafe and Gen-3 ‘Fast’ (G3F) silicon-carbide (SiC) power components. The company claims the ...
Challenges when dealing with high-power-density designs. Utilizing cloud manufacturing platforms (CMPs). Power packaging using additive manufacturing. Today’s designers are now more equipped to ...
Decades ago, the entrance to the somewhat sleepy Francis Bitter National Magnet Lab at MIT was decorated with a movie poster from The Magnetic Monster, a 1953 American science fiction film. Since then ...
Navitas delivers efficient 4.5 kW power in the smallest power-supply form-factor for latest AI GPUs that demand 3x more power per rack TORRANCE, Calif., July 25, 2024 (GLOBE NEWSWIRE) -- Navitas ...
This AF430S motor from Turntide Technologies answers a call for electrification in components in industrial equipment and performance vehicles. The lightweight axial flux motor delivers up to 96% ...
A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
Infineon Technologies AG has released the next generation of high-density power modules, supporting AI and high-performance data-center compute. Data centers represent two percent of global energy ...
Rather than designing your own robotic joint by purchasing a series of components, integrating them to provide their best features and coming up with a mounting structure that takes into consideration ...
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