In a 3D-IC system several die share the same network supplies. The power grid analysis (PGA) tool must concurrently analyze all the dies, since the voltage drop for one could be directly linked to ...

Deep space probes and frontline soldiers share a basic problem: once they leave the grid, every watt has to be carried in.

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

The power electronics industry and the semiconductor industry, inseparably intertwined with one another, are facing unprecedented efficiency, cost, construction and thermal challenges which provide ...

If you are looking to add a little extra gaming time to your 3DS console, CTA Digital has released a new Nintendo 3DS Deluxe Power Grip which will provide you with extra juice for those extended ...

Issues with the global supply chain have impacted the power generation sector, in much the same way those problems have affected other industries. Sourcing of materials, including spare parts for ...

We are really letting loose now with our Intel X79 Express content and next up is another GIGABYTE video related to said product and this time it's another software feature called 3D Power and it's ...

New and emerging technologies for 3D packaging are being deployed at the printed-circuit-board (PCB) level. Power-density goals can be simplified with component integration into chip-scale packages ...